@Article{ChiappimTDPFGGVM:2016:InO2Pl,
author = "Chiappim, William and Testoni, Georgio Ernesto and Doria, A. C. O.
C. and Pessoa, R. S. and Fraga, Mariana Amorim and Galv{\~a}o, N.
K. A. M. and Grigorov, K. G. and Vieira, L. and Maciel, H. S.",
affiliation = "{Universidade do Vale do Para{\'{\i}}ba (UNIVAP)} and
{Universidade do Vale do Para{\'{\i}}ba (UNIVAP)} and
{Universidade do Vale do Para{\'{\i}}ba (UNIVAP)} and
{Universidade do Vale do Para{\'{\i}}ba (UNIVAP)} and {Instituto
Nacional de Pesquisas Espaciais (INPE)} and {Instituto
Tecnol{\'o}gico de Aeron{\'a}utica (ITA)} and {Space Research
and Technology Institute} and {Universidade do Vale do
Para{\'{\i}}ba (UNIVAP)} and {Universidade do Vale do
Para{\'{\i}}ba (UNIVAP)}",
title = "Relationships among growth mechanism, structure and morphology of
PEALD TiO2 films: the influence of O2 plasma power, precursor
chemistry and plasma exposure mode",
journal = "Nanotechnology",
year = "2016",
volume = "27",
number = "30",
pages = "305701",
month = "July",
keywords = "Brazilian MRS, plasma-enhanced atomic layer deposition, titanium
dioxide, x-ray diffraction, morphology, RBS.",
abstract = "Titanium dioxide (TiO2) thin films have generated considerable
interest over recent years, because they are functional materials
suitable for a wide range of applications. The efficient use of
the outstanding functional properties of these films relies
strongly on their basic characteristics, such as structure and
morphology, which are affected by deposition parameters. Here, we
report on the influence of plasma power and precursor chemistry on
the growth kinetics, structure and morphology of TiO2 thin films
grown on Si(100) by plasma-enhanced atomic layer deposition
(PEALD). For this, remote capacitively coupled 13.56 MHz oxygen
plasma was used to act as a co-reactant during the ALD process
using two different metal precursors: titanium tetrachloride
(TiCl4) and titanium tetraisopropoxide (TTIP). Furthermore, we
investigate the effect of direct plasma exposure during the
co-reactant pulse on the aforementioned material properties. The
extensive characterization of TiO2 films using Rutherford
backscattering spectroscopy, ellipsometry, x-ray diffraction
(XRD), field-emission scanning electron microscopy, and atomic
force microscopy (AFM) have revealed how the investigated process
parameters affect their growth per cycle (GPC), crystallization
and morphology. The GPC tends to increase with plasma power for
both precursors, however, for the TTIP precursor, it starts
decreasing when the plasma power is greater than 100 W. From XRD
analysis, we found a good correlation between film crystallinity
and GPC behavior, mainly for the TTIP process. The AFM images
indicated the formation of films with grain size higher than film
thickness (grain size/film thickness ratio approximate to 20) for
both precursors, and plasma power analysis allows us to infer that
this phenomenon can be directly related to the increase of the
flux of energetic oxygen species on the substrate/growing film
surface. Finally, the effect of direct plasma exposure on film
structure and morphology was evidenced showing that the grid
removal causes a drastic reduction in the grain size, particularly
for TiO2 synthesized using TiCl4.",
doi = "10.1088/0957-4484/27/30/305701",
url = "http://dx.doi.org/10.1088/0957-4484/27/30/305701",
issn = "0957-4484",
language = "en",
targetfile = "chiappim_relationships.pdf",
urlaccessdate = "27 abr. 2024"
}